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Institute for Extreme Semiconductor Chips

  • Two researchers in white lab coats looking through microscopes in a yellow-colored room for chip packaging.

Step 3: Chip Packaging and Circuits

Once the extreme semiconductor materials and chips have been established, the final step is to package them in a form useful for use in circuits. The development of these circuits will allow for the extreme chips to be used in many different applications across industries.

Novel Packaging Approaches 

The extreme environment in which this next generation of semiconductor chips are to operate requires the development of new chip packaging and circuit innovations. 

In order to create these novel packing approaches, we will develop, fabricate and test integrated circuits utilizing semiconductor components. These integrated circuits also serve as an important instrument for commercialization by making the chip prototypes safe for technology transfer and entrepreneurship.

Project Significance

  • Once the extreme semiconductor chips are integrated into circuits, they can be used to fulfill a variety of different needs based on industry and purpose. We anticipate new solutions for chips to withstand extreme conditions, including smaller, lighter and more flexible applications for medical wearables.

  • This research allows for the safe transfer of the extreme semiconductor chips and, as a result, the findings of our research can be shared. 

Research Innovation 

New and robust gate-oxide materials that can sustain extreme electric fields are being created to use in our novel packaging technology to aid in thermal management.

By engaging with the School of Public Health's Exercise Science Department at the University of South Carolina, we can package our flexible sensors and integrate them with our USC developed bespoke wearable biometric platform to demonstrate heart-rate detection on children, where sensor flexibility is a key requirement for participant comfort.

Research Aims

  1. Develop integrated circuits that can deal with heat and electromagnetic interference for use in power electronics

  2. Determine how to integrate different type of chips together for use in optical electronics

  3. Find a way to connect chips in a flexible way to be used in medical wearables

Purpose: To develop, fabricate and test integrated circuits utilizing extreme semiconductor components

Hypothesis: New and robust gate-oxide materials that can sustain extreme electric fields will aid in thermal management and allow for novel chip packaging approaches.

Goal: Develop integrated circuits and chip packaging that can withstand extreme environments and be safely transferred

Vision: Packaging of the extreme semiconductor chips that allows for a variety of uses and aids in commercialization, plus applications for the public good

SC Impact

The extreme semiconductors developed by our research team will lead to unprecedented energy performance and efficiency across South Carolina. While this is a state-wide research focus, certain areas of public interest will benefit greatly from this institute's work. 

Leadership in Innovative Technology

Our work and research puts South Carolina on the map in innumerable areas of rapidly advancing technology. Our state will receive new opportunities and recognition by having this world-changing technology right here at the university. 

Economic Development and Engagement

A stronger reputation for technology and innovation will draw and retain more top talent in South Carolina, creating more opportunities in multiple fields throughout the state.

Public Health Advancements

We are changing the future of public health technology with extreme semiconductor chips to support medical devices and products that create a better standard of care across the state, the nation and the world—and it all starts here in South Carolina.



Notable Awards, Outcomes, and Practical Uses for this Research 

  • Comfortable Medical Wearables: With novel packaging, the extreme chips can be integrated with wearable biometric platforms, where sensor flexibility is a key requirement for participant comfort.
  • Heat-Tolerant Power Electronics: By using integrated circuits that can deal with heat and electromagnetic interference, power electronics can withstand higher temperatures.
  • Optical Electronics: The integration of different type of chips together will allow for extreme semiconductor chip use in optical electronics.

Challenge the conventional. Create the exceptional. No Limits.

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