Once the extreme semiconductor materials and chips have been established, the final
step is to package them in a form useful for use in circuits. The development of these
circuits will allow for the extreme chips to be used in many different applications
across industries.
Novel Packaging Approaches
The extreme environment in which this next generation of semiconductor chips are to
operate requires the development of new chip packaging and circuit innovations.
In order to create these novel packing approaches, we will develop, fabricate and
test integrated circuits utilizing semiconductor components. These integrated circuits
also serve as an important instrument for commercialization by making the chip prototypes
safe for technology transfer and entrepreneurship.
Project Significance
Once the extreme semiconductor chips are integrated into circuits, they can be used
to fulfill a variety of different needs based on industry and purpose. We anticipate
new solutions for chips to withstand extreme conditions, including smaller, lighter
and more flexible applications for medical wearables.
This research allows for the safe transfer of the extreme semiconductor chips and,
as a result, the findings of our research can be shared.
Research Innovation
New and robust gate-oxide materials that can sustain extreme electric fields are being
created to use in our novel packaging technology to aid in thermal management.
By engaging with the School of Public Health's Exercise Science Department at the
University of South Carolina, we can package our flexible sensors and integrate them
with our USC developed bespoke wearable biometric platform to demonstrate heart-rate
detection on children, where sensor flexibility is a key requirement for participant
comfort.
Research Aims
Develop integrated circuits that can deal with heat and electromagnetic interference for use in power electronics
Determine how to integrate different type of chips together for use in optical electronics
Find a way to connect chips in a flexible way to be used in medical wearables
Purpose: To develop, fabricate and test integrated circuits utilizing extreme semiconductor
components
Hypothesis:New and robust gate-oxide materials that can sustain extreme electric fields will
aid in thermal management and allow for novel chip packaging approaches.
Goal: Develop integrated circuits and chip packaging that can withstand extreme environments
and be safely transferred
Vision:Packaging of the extreme semiconductor chips that allows for a variety of uses and
aids in commercialization, plus applications for the public good
The extreme semiconductors developed by our research team will lead to unprecedented
energy performance and efficiency across South Carolina. While this is a state-wide
research focus, certain areas of public interest will benefit greatly from this institute's
work.
Leadership in Innovative Technology
Our work and research puts South Carolina on the map in innumerable areas of rapidly
advancing technology. Our state will receive new opportunities and recognition by
having this world-changing technology right here at the university.
Economic Development and Engagement
A stronger reputation for technology and innovation will draw and retain more top
talent in South Carolina, creating more opportunities in multiple fields throughout
the state.
Public Health Advancements
We are changing the future of public health technology with extreme semiconductor
chips to support medical devices and products that create a better standard of care
across the state, the nation and the world—and it all starts here in South Carolina.
Comfortable Medical Wearables: With novel packaging, the extreme chips can be integrated with wearable biometric platforms, where sensor flexibility is a key requirement
for participant comfort.
Heat-Tolerant Power Electronics: By using integrated circuits that can deal with heat and electromagnetic interference, power electronics can withstand higher temperatures.
Optical Electronics: The integration of different type of chips together will allow for extreme semiconductor chip use in optical electronics.
Challenge the conventional. Create the exceptional. No Limits.