DARPA Subcontract
This subcontract from Northrup-Grumman is to develop extreme semiconductor AlN coatings on 4-in wafers of SiC as thermal management for extreme RF transistors at $300,000 per year up to 3 years.
The institute's collaborative research on extreme semiconductor chip development is supported by funding from grants and strategic partners.
The research conducted by this institute is made possible in large part by funding and grants from our strategic partners.
This subcontract from Northrup-Grumman is to develop extreme semiconductor AlN coatings on 4-in wafers of SiC as thermal management for extreme RF transistors at $300,000 per year up to 3 years.
Funding from AFOSR ($600,000) and NSF ($500,000) to support laser liftoff for III-nitrides from growth wafer substrates to eliminate substrate bottleneck in thermal performance for high power applications.
Funding for both science and infrastructure projects, including III-nitride extreme lasers at $200,000 per year since 2017 and atom columns-imaging beyond the virtual crystal approximation at $2 million total.
Funding for this interdisciplinary research institute was generously provided by the USC Office of the President and Office of the Vice President for Research.